Customization: | Available |
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After-sales Service: | Free Installing and Training, Technical Support |
Warranty: | One Year Limited Warranty |
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PVD, PECVD coating system machine with DC, MF, RF magnetron sputtering system
PVD, short for physical vapor deposition, is the technology to deposit thin film by evaporating or sputtering the material under the vacuum conditions. A vacuum chamber is necessary to avoid reaction of the vaporized material with air. PVD coating is used to provide new, additional value and features to the product, such as vivid color, abrasion resistance and reduced friction coatings. In general, HCVAC is specialized in PVD coatings.
HCVAC manufactures and supplies all kinds of PVD vacuum coating machines. Now it is a market leader in the high-vacuum treatment field with customers from all around the world. Huicheng produces a complete range of machinery, offering different types of processes: high vacuum evaporation, multi-arc, DC sputtering, MF magnetron sputtering, continuous magnetron sputtering line etc.
Applied industries:
Surface vacuum coating for watch&clock, jewelries, tools, plastic, stainless steel sheet etc.
HCVAC decorative PVD films are routinely used as a replacement for electroplated chrome. They can be applied directly over almost any substrate material and can be deposited in a wide variety of colors. The process parameters to deposit each color are stored in software recipes with different process steps. Once the coating process has started, all of the relevant process parameters are continuously monitored and controlled by the on-board computer software.
Mode Dimension |
JTL-900 | JTL-1100 | JTL-1250 |
900*1000mm | 1100*1000mm | 1250*1100mm | |
Coating mode and main confirguration |
Six multi-arc targets + one set of column targets + one set of plane rectangle magnetron sputtering targets | Six multi-arc targets + a pair of twin (MF)magnetron sputtering targets |
Twelve multi-arc targets + two sets of plane rectangle magnetron sputtering targets+ a pair of twin (MF)magnetron sputtering targets |
Power source | Electric arc power, DC magnetron power, MF magnetron power, filament power, pulse power, linear ionized source. | ||
Process gas control | Quality flowmeter + electromagnetism ceramic valve | ||
Vacuum chamber structure | Vertical single(side) door, pump system postposition, double water-cooling | ||
Vacuum system | Molecule pump +Roots pump +Mechanical pump(5.0*10 -5 Pa) Diffusion pump +Roots pump +Mechanical pump(5.0*10 -4 Pa) |
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Workpiece baking temperature | Normal temperature to 350 centi-degree PID control, radiation heating. |
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Workpiece motion mode | Public rotation Frequency control: 0-20 rotation per minute | ||
Measure mode | Number display composite vacuum gauge: from atmosphere to 1.0*10 -5 Pa | ||
Control mode | Manual/Automatic/PC/PLC + HMI/PC four choice of control mode | ||
Remark | We can design the dimension of the equipment according to customer's special technique requirement. |